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PCB Laser Depaneling for Rigid-Flex Boards- No Stress, No Delamination

PCB Laser Depaneling for Rigid-Flex Boards: No Stress, No Delamination

The immediate, measurable benefits include absolute zero mechanical vibration, no substrate warping, the complete elimination of fiberglass burrs, and a microscopic 25μm kerf width that allows you to maximize your panel yield and save massive amounts of money on expensive rigid-flex laminates.